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Hot Melt Molding Product List

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Hot Melt Molding Case Study: "Internal Wiring of Enclosures"

We solved the request to tidy up the internal wiring of the enclosure with hot melt molding!

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, shock resistance, insulation, and housing functionality. In this catalog, we introduce examples that address the desire to tidy up the internal wiring of small devices using hot melt molding technology. [Challenges] - Poor organization of internal wiring - When users open the housing for battery replacement, the appearance is not good [Benefits] - Fixing the harness in any shape with hot melt molding *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Other electronic parts
  • Coating Agent
  • Hot Melt Molding

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Hot melt molding

Due to low temperature, low pressure, and low-speed molding, there is less stress on electronic components and printed circuit boards!

"Hot Melt Molding" is a molding technology using adhesive-based resins (polyamide, polyester, polyolefin). It is suitable for protecting substrates and electronic components using one-component thermoplastic resins. Due to its high adhesive strength, it excels in waterproofing, drip-proofing, and dust-proofing, and the molds can be smaller, which helps reduce initial costs. 【Features】 ■ Minimal stress on electronic components and printed circuit boards ■ Excellent waterproofing, drip-proofing, and dust-proofing due to high adhesive strength ■ Smaller molds help reduce initial costs ■ Resolves surface irregularities and void issues during potting *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Hot Melt Molding

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Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.

"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, utilizes thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We propose a sustainable hot melt made primarily from natural fatty acids. At the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the actual process of hot melt sealing electronic components. Customers interested in visiting are encouraged to inquire.

  • plastic
  • Coating Agent
  • Other electronic parts
  • Hot Melt Molding

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Hot Melt Molding Case Study: "Waterproof Connector"

Introduction to the hot melt molding method that completes 4 waterproof connectors in 30 seconds.

Hot melt molding is a molding technique that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold at low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce examples of process improvement and value analysis through the switch from waterproof connector rubber bushings. [Challenge] We want to waterproof the wire insertion area. *For more details, please refer to the catalog or feel free to contact us.

  • Processing Contract
  • Coating Agent
  • Automotive Connectors
  • Hot Melt Molding

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